NTHS5443
Power MOSFET
?20 V, ?4.9 A, P?Channel ChipFET t
Features
?
?
?
?
Low R DS(on) for Higher Efficiency
Logic Level Gate Drive
Miniature ChipFET Surface Mount Package Saves Board Space
Pb?Free Package is Available
V (BR)DSS
http://onsemi.com
R DS(on) TYP
I D MAX
Applications
? Power Management in Portable and Battery?Powered Products; i.e.,
Cellular and Cordless Telephones and PCMCIA Cards
MAXIMUM RATINGS (T A = 25 ° C unless otherwise noted)
?20 V
G
56 m W @ ?4.5
S
?4.9 A
Steady
Rating
Symbol
5 secs
State
Unit
Drain?Source Voltage
Gate?Source Voltage
V DS
V GS
?20
" 12
V
V
D
P?Channel MOSFET
Continuous Drain Current
(T J = 150 ° C) (Note 1)
T A = 25 ° C
T A = 85 ° C
Pulsed Drain Current
Continuous Source Current (Note 1)
Maximum Power Dissipation (Note 1)
T A = 25 ° C
T A = 85 ° C
I D
I DM
I S
P D
?4.9
?3.5
?4.9
2.5
1.3
" 15
?3.6
?2.6
?3.6
1.3
0.7
A
A
A
W
8
1
PIN
CONNECTIONS
ChipFET
CASE 1206A
STYLE 1
MARKING
DIAGRAM
Operating Junction and Storage
T J , T stg
?55 to +150
° C
Temperature Range
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.27 in sq
D 8
D 7
D 6
S 5
1 D
2 D
3 D
4 G
1
2
3
4
8
7
6
5
[1 oz] including traces).
A4 = Specific Device Code
M = Month Code
G
= Pb?Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NTHS5443T1
NTHS5443T1G
Package
ChipFET
ChipFET
(Pb?Free)
Shipping ?
3000/Tape & Reel
3000/Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2005
July, 2005 ? Rev. 6
1
Publication Order Number:
NTHS5443T1/D
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